SK hynix says the global memory market may remain supply-constrained through the end of 2030, extending a tight cycle driven by AI infrastructure and high-bandwidth memory demand. The company has also signaled that it remains open to additional investment in the United States, although no new fabrication project has been finalized. Its Indiana project is focused on advanced HBM packaging and AI-chip research, with production planned later this decade.
The distinction matters because packaging capacity and wafer production solve different bottlenecks. Even if advanced packaging expands, shortages can persist if DRAM wafer supply does not rise fast enough. For device makers and cloud operators, that means memory availability and pricing could remain a planning constraint for several more years rather than easing quickly after the current AI investment cycle.